Applied Materials, Inc. and BE Semiconductor Industries N.V. (Besi) announced an agreement to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.   As traditional 2D scaling slows, the semiconductor industry is shifting towards heterogeneous design and chip integration as a new wa...